"Founded in October 1978 as Grinding Technology Inc., GTI Technologies began as a representative organization providing sales and service for a number of precision European Precision Grinding machine manufacturers throughout North America.



In the beginning, our customer base consisted of traditional automotive, aerospace and general manufacturing customers. Shortly thereafter, we began working with GMN and Bell Lab’s engineers to develop the first silicon wafer backside grinders for the fledgling semiconductor industry. The emergence of the semiconductor and electronics industries opened new doors of opportunity for GTI. We soon added new lines to our semiconductor products including Takatori Corporation, who was an industry leader in automated tape /de-tape systems to support the back grinding process."